Coatings and Back-thinning
Teledyne e2v has a broad range of specialist on die anti-reflective (AR) coatings, package surface treatment and window spectral filter design and process capabilities including up to 8 inch silicon wafer back-thinning and die, package and optical window coatings and filters.
Our well established ability to back-thin image sensors is an important component of our capability. The back-thinning process has been developed and refined over many years to the stage where it is a reliable wafer scale operation, with proven variety of optimisations for different wavelength applications.
Teledyne e2v has recently upgraded the operation to process 8 inch wafers with optimised anti-reflection (AR) coatings for applications from ultraviolet (UV) to near infrared for applications such as ground and space astronomy, science and other applications. The upgrade to 8 inch wafer processing includes the development of low reflection coatings over the light shielded part of the image sensors being of particular relevance to new Teledyne product families, especially very large area sensors, which will enable the provision of CMOS and CCD devices that almost completely fill an 8 inch wafer.
Of particular focus has been the design and development of three families of AR coatings to optimise the optical performance achieving stable high quantum efficiency (QE) at VUV and UV wavelengths. This is achieved by depositing materials as part of the back-thinning process using novel technology. High stable UV QE is attained by a combination of optimised AR coatings and controlling the charge state at the back surface.
Teledyne is able to actively collaborate with other organisations an example is where we are working with JPL on providing a back-thinning solution using their delta doped process for some specific requirements.
